Content Description

Contains information related to soldering processes, and solder joint performance and reliability. Covers soldering fundamentals, technology, materials, substrate materials, fluxes, pastes, assembly processes, inspection, and environment. Covers today\'s advanced joining applications and emphasizes new materials, including higher strength alloys; predictive performance; computer modeling; advanced inspection techniques; new processing concepts, including laser heating; and the resurgence in ultrasonic soldering. Written by Dr. Paul T. Vianco of Sandia National Laboratories as a project of the AWS C3 Committee on Brazing and Soldering. 

This book also exists in the following packages...