- Cover page
- Cover page
- Title page
- Title page
- Copyright page
- Copyright page
- Personnel
- Personnel
- Preface
- Preface
- Table of Contents
- Table of Contents
- List of Tables
- List of Tables
- List of Figures
- List of Figures
- Guideline for Hand Soldering Practices
- Guideline for Hand Soldering Practices [Go to Page]
- 1. Fundamental Understanding
- 1. Fundamental Understanding [Go to Page]
- 1.1 Hand Soldering.
- 1.1 Hand Soldering.
- 1.2 Wettability and Solderability.
- 1.2 Wettability and Solderability.
- 1.3 Heating process.
- 1.3 Heating process.
- 2. Base Materials
- 2. Base Materials [Go to Page]
- 2.1 Solderability.
- 2.1 Solderability.
- 2.2 Temperature Sensitivity.
- 2.2 Temperature Sensitivity.
- 2.3 Metallic Base Materials.
- 2.3 Metallic Base Materials.
- 2.4 Coatings
- 2.4 Coatings
- 2.5 Nonmetallic Base Materials—Ceramics and Glasses
- 2.5 Nonmetallic Base Materials—Ceramics and Glasses
- 3. Filler Metals
- 3. Filler Metals [Go to Page]
- 3.1 Materials Technology
- 3.1 Materials Technology
- 3.2 Processing Effects
- 3.2 Processing Effects
- 3.3 Standards and Specifications
- 3.3 Standards and Specifications
- 4. Fluxes and Controlled Atmospheres
- 4. Fluxes and Controlled Atmospheres [Go to Page]
- 4.1 Function of the Flux
- 4.1 Function of the Flux
- 4.2 Flux Compositions
- 4.2 Flux Compositions [Go to Page]
- 4.2.1 Inorganic Fluxes
- 4.2.1 Inorganic Fluxes
- 4.2.2 Organic Acid Fluxes
- 4.2.2 Organic Acid Fluxes
- 4.2.3 Rosin-Based Fluxes
- 4.2.3 Rosin-Based Fluxes
- 4.2.4 No-Clean and Low-Solids Fluxes
- 4.2.4 No-Clean and Low-Solids Fluxes
- 4.2.5 Other Fluxes
- 4.2.5 Other Fluxes
- 4.3 Standards and Specifications
- 4.3 Standards and Specifications
- 4.4 Proper Use of a Flux
- 4.4 Proper Use of a Flux [Go to Page]
- 4.4.1 Applying Flux at the Beginning of the Soldering Process
- 4.4.1 Applying Flux at the Beginning of the Soldering Process
- 4.4.2 Applying Flux During the Soldering Process
- 4.4.2 Applying Flux During the Soldering Process
- 4.5 Controlled Atmospheres
- 4.5 Controlled Atmospheres
- 5. Process Development
- 5. Process Development [Go to Page]
- 5.1 Introduction
- 5.1 Introduction
- 5.2 Preassembly Cleaning
- 5.2 Preassembly Cleaning [Go to Page]
- 5.2.1 Organic Contaminants
- 5.2.1 Organic Contaminants
- 5.2.2 Inorganic Contaminants
- 5.2.2 Inorganic Contaminants
- 5.2.3 Mechanical Abrasion
- 5.2.3 Mechanical Abrasion
- 5.3 Fixtures
- 5.3 Fixtures
- 5.4 Soldering with an Iron
- 5.4 Soldering with an Iron [Go to Page]
- 5.4.1 Equipment
- 5.4.1 Equipment
- 5.4.2 Soldering Procedures—Tip Conditioning
- 5.4.2 Soldering Procedures—Tip Conditioning
- 5.4.3 Soldering Procedures—Solder Wire
- 5.4.3 Soldering Procedures—Solder Wire
- 5.4.4 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.4.4 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.5 Soldering with a Torch (Flame)
- 5.5 Soldering with a Torch (Flame) [Go to Page]
- 5.5.1 Equipment
- 5.5.1 Equipment
- 5.5.2 Soldering Procedures—Solder Wire
- 5.5.2 Soldering Procedures—Solder Wire
- 5.5.3 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.5.3 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.5.4 Butt Joints: Cylinder-to-Cylinder, Cylinder-to-Plate, and Plate-to-Plate:
- 5.5.4 Butt Joints: Cylinder-to-Cylinder, Cylinder-to-Plate, and Plate-to-Plate:
- 5.5.5 Lap Joints: Cylinder-to-Cylinder, Plate-to-Plate, and Cylinder-to-Plate:
- 5.5.5 Lap Joints: Cylinder-to-Cylinder, Plate-to-Plate, and Cylinder-to-Plate:
- 5.6 Soldering with Hot Air or Hot Inert Gas
- 5.6 Soldering with Hot Air or Hot Inert Gas [Go to Page]
- 5.6.1 Equipment
- 5.6.1 Equipment
- 5.6.2 Soldering Procedures—Solder Wire or Preplaced Solder Preforms or Paste
- 5.6.2 Soldering Procedures—Solder Wire or Preplaced Solder Preforms or Paste
- 5.7 Resistance Soldering
- 5.7 Resistance Soldering [Go to Page]
- 5.7.1 Equipment
- 5.7.1 Equipment
- 5.7.2 Soldering Procedures—Solder Wire
- 5.7.2 Soldering Procedures—Solder Wire
- 5.7.3 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.7.3 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.8 Induction Soldering
- 5.8 Induction Soldering [Go to Page]
- 5.8.1 Equipment
- 5.8.1 Equipment
- 5.8.2 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.8.2 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.9 Other Hand Soldering Techniques: Laser Soldering and Infrared Soldering
- 5.9 Other Hand Soldering Techniques: Laser Soldering and Infrared Soldering [Go to Page]
- 5.9.1 Equipment
- 5.9.1 Equipment
- 5.9.2 Soldering Procedures—Solder Wire
- 5.9.2 Soldering Procedures—Solder Wire
- 5.9.3 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.9.3 Soldering Procedures—Preplaced Solder Preforms or Paste
- 5.10 Post-Assembly Cleaning
- 5.10 Post-Assembly Cleaning [Go to Page]
- 5.10.1 Introduction
- 5.10.1 Introduction
- 5.10.2 Equipment
- 5.10.2 Equipment
- 5.10.3 Postsoldering Cleaning Processes
- 5.10.3 Postsoldering Cleaning Processes
- 5.11 Rework and Repair
- 5.11 Rework and Repair
- 6. Environmental Safety and Health
- 6. Environmental Safety and Health [Go to Page]
- 6.1 Hand Soldering Hazards
- 6.1 Hand Soldering Hazards
- 6.2 Regulations and Guidelines
- 6.2 Regulations and Guidelines [Go to Page]
- 6.2.1 AWS Safety and Health References
- 6.2.1 AWS Safety and Health References
- 6.2.2 AWS Safety and Health Fact Sheets
- 6.2.2 AWS Safety and Health Fact Sheets
- 6.2.3 Government and Industrial Resources
- 6.2.3 Government and Industrial Resources
- 7. List of AWS Technical Documents on Brazing and Soldering
- 7. List of AWS Technical Documents on Brazing and Soldering [Go to Page]